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OFDMA changed that. By composing subcarriers into resource units (RU), OFDMA channels can dynamically divide the instantaneous bandwidth to different users. OFDMA has suddenly increased the number of users that are instantly supported. The 20MHz bandwidth in the following figure is an example. Through subcarrier allocation, 20MHz can support up to 9 devices to access at the same time, 40MHz can support 18 devices, and so on. Fig. 2 uses the number of resource units available under OFDMA’s 20MHz% 0AWi-Fi 6 in which each subcarrier is 78.125khz. 20MHz is 256 subcarriers. 6 Edge indicates that there are 6 subcarriers as protection bands from the edge. ) It can be said that OFDMA has brought about a qualitative change in the capacity of Wi-Fi channels.
With the increasing degree of automation of cars and electric vehicles, the number of semiconductors required will increase sharply. Most semiconductors are traditional analog and power semiconductors. These traditional analog and power semiconductors are produced by 8-inch factories. Because it is difficult to ensure 8-inch manufacturing equipment, it is difficult to add new 8-inch semiconductor factories. In short, self-driving cars certainly need state-of-the-art semiconductors to run advanced artificial intelligence (AI), but the need for a large number of traditional analog and power semiconductors has become the Achilles’ heel of automobile production, and it is not easy to solve this problem. Although the automobile industry has ushered in an once-in-a-century period of great change in CASE (Connected, Autonomous/Automated, Shared, Electric), it is also an era suffering from the shortage of semiconductors.
The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.
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