Sem/eds analysis company in the USA right now? Conclusion: Based on the analytical report, the client was able to demonstrate that the particles were consistent with a common aspirin tablet. When the end customer was approached with this report, they remembered that their spouse had taken an aspirin earlier that morning, and had likely used the bottle of water in question to do so. Based on this, the customer was happy, the manufacturing client was satisfied, and the sample was maintained – undestroyed should someone need to examine the sample again or do any more esoteric testing. For an affordable price, the client was able to get piece of mind, and gather information from a very wide range of testing methods quickly and accurately.
SEM allows for high magnification surface examinations of a wide variety of samples. Providing brilliant resolution as well as incredible depth of field, the SEM, especially when combined with EDS, is often considered the most powerful analytical tool of our time. Let us show you why. X-ray imaging allows us to look inside of a device without opening it up. This real-time nondestructive inspection technique can be used on packaged electronic devices to one of a kind ancient artifacts. With rapid image acquisition and high sample throughput, X-ray imaging is particularly useful for sample screening and quality control issues. It is also often the first step in failure analysis and polished cross section projects.
Have you always been located in Chelmsford, MA? No, for the first four years MicroVision Labs operated at 15 A Street, Burlington, MA. In 2007 we moved to our present location in Chelmsford, MA. What business designation does MicroVision Labs have? MicroVision Labs is designated as a veteran owned small business. How many staff members does MicroVision Labs have? MicroVision Labs is a small business employing 5-10 full-time, part-time, and contract employees. Explore even more details at click here. ?We partner with companies in all phases of product development and sales, including R&D, manufacturing, QC, advertising and failure analysis. Our laboratory offers a highly-trained and experienced staff utilizing a powerful set of analytical tools (SEM with EDS and backscatter detectors, Bruker X-Flash elemental mapping, X-Ray imaging, Micro-FTIR spectroscopy, Micro-XRF, light microscopy, cross sectioning/precision polishing and microhardness testing).
Close examination of any possible defects or voids was undertaken at higher magnification. The voids did not appear to create any structural or conductivity issues. Additionally, the formation and contiguity of intermetallic bonds between the contacts and solder were shown using a combination of EDS line scan elemental spectroscopy and elemental mapping. The SEM image and the EDS map to the left show the intermetallic layer between the copper wire and the tin/lead solder via the mixture of the red copper and the blue tin.
Dust samples were analyzed using polarized light microscopy (PLM) to provide percentages of the particle types present in the samples. MVL was able to determine that there was significant loading of glass fibers in the dust samples with the likely source being contractor’s work in the attic which involved disturbing the fiberglass insulation. The image on the right shows a few distinct glass fibers with a binder material adhered to them, consistent with fiberglass insulation. See more details on this website.
